HX426C16FB3K2/16
16GB (8GB 1G x 64-Bit x 2 pcs.) DDR4-2666 CL16 288-Pin DIMM Kit
HyperX HX426C16FB3K2/16 is a kit of two 1G x 64-bit (8GB)
DDR4-2666 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory
module, based on eight 1G x 8-bit FBGA components per module.
Each module kit supports Intel® Extreme Memory Profiles
(Intel® XMP) 2.0. Total kit capacity is 16GB. Each module has
been tested to run at DDR4-2666 at a low latency timing of 16-18-18
at 1.2V. Additional timing parameters are shown in the
Plug-N-Play (PnP) Timing Parameters section below. The
JEDEC standard electrical and mechanical specifications are
as follows:
FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Height 1.3425” (34.1mm), w/heatsink
CoolerMaster MasterBox MB311L Case: Tempered Glass, 1x 120mm Fan, 2x USB 3.0, Supports: mATX/mini-ITX , Black
ASRock B450M/AC MB B450 Micro-ATX: AM4 Socket For AMD Ryzen Processors Ultra M.2, 4x DDR4, 4x SATA 6Gbps, 1x Gigabit LAN, Intel 802.11ac +BT4.2, 1 PCIe 3.0 x16, 1 PCIe 2.0 x16, USB 3.2, HDMI, Audio 7.1
4Pin Molex LP4 12V Power to 4x 3Pin/4Pin Case Cooling Fan Convert Cable Adapter 




